DSCC 25203:2024
Current
Current
The latest, up-to-date edition.
MICROCIRCUIT, MEMORY, DIGITAL, CMOS, RADIATION HARDENED, Gen3, 1 GBit, 32 M x 32, MAGNETORESISTIVE RAM (MRAM), MONOLITHIC SILICON
Published date
31-12-2024
Publisher
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This drawing documents two product assurance class levels consisting of high reliability (device class Q) and space application (device class V).
| DocumentType |
Standard
|
| PublisherName |
Defense Supply Centre Columbus
|
| Status |
Current
|
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| MIL-PRF-38535 Revision L:2018 | Integrated Circuits (Microcircuits) Manufacturing, General Specification for |
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