FOREWORD
CONTENTS
1 SCOPE
2 GENERAL
2.1 Related Documents
2.2 Units, symbols and terminology
2.3 Preferred values
2.4 Marking
3 QUALITY ASSESSMENT PROCEDURES
3.1 Qualification approval/Quality assessment system
3.2 Primary stage of manufacture
3.3 Structurally similar components
3.4 Qualification approval procedures
3.5 Quality conformance inspection
3.6 Alternative test methods
3.7 Unchecked parameters
4 TEST AND MEASUREMENT PROCEDURES
4.1 General
4.2 Standard atmospheric conditions
4.3 Drying
4.4 Visual examination and check of dimensions
4.5 Insulation resistance
4.6 Voltage proof
4.7 Inductance
4.8 Insertion loss
4.9 Robustness of terminations
4.10 Resistance to soldering heat
4.11 Solderability
4.12 Rapid change of temperature
4.13 Vibration
4.14 Bump
4.15 Shock
4.16 Container sealing
4.17 Climatic sequence
4.18 Damp heat, steady state
4.19 Temperature rise
4.20 Endurance
4.21 Passive flammability
4.22 Active flammability
4.23 Solvent resistance of marking
4.24 Component solvent resistance
ANNEX A - INTERPRETATION OF SAMPLING PLANS AND PROCEDURES
AS DESCRIBED IN IEC 410 FOR USE WITHIN THE CECC SYSTEM
FOR ELECTRONIC COMPONENTS