EN 165000-3:1996

1 SCOPE
2 DOCUMENT INFORMATION
  2.1 Introduction and use
  2.2 Related documents
3 GENERAL REQUIREMENTS
  3.1 Report front sheets and authentication
  3.2 Description of report/company structure
  3.3 Approval information
  3.4 Summary of testing
  3.5 Analytical methods
  3.6 Control of procurement sources and incoming material
  3.7 Environmental control and static handling
  3.8 Major change notification
  3.9 Hybrid design
4 THICK FILM PROCESSING
  4.1 Artwork & Screen fabrication
  4.2 Substrates
  4.3 Substrate saw or scribe and break and substrate hole
       drilling
  4.4 Thick film pastes and printing
  4.5 Drying and firing
  4.6 Resistor trimming
  4.7 Inspection and test of processing
  4.8 Rework
5 THIN FILM PROCESSING
  5.1 Artwork and mask fabrication
  5.2 Substrates
  5.3 Substrate saw or scribe and break and substrate hole
       drilling
  5.4 Thin film processing materials and pattern forming
  5.5 Drying and stabilization
  5.6 Resistor trimming
  5.7 Rework
6 HYBRID ASSEMBLY
  6.1 Solder assembly
       6.1.1 Kitting
       6.1.2 Cleaning
       6.1.3 Component placement
       6.1.4 Substrate attach
       6.1.5 Soldering
       6.1.6 Encapsulation
       6.1.7 Rework
       6.1.8 Marking
  6.2 Chip & Wire
       6.2.1 Kitting
       6.2.2 Cleaning
       6.2.3 Component placement
       6.2.4 Substrate attach
       6.2.5 Wirebonding
       6.2.6 Package seal
       6.2.7 Rework
       6.2.8 Marking
7 TEST AND SHIPPING
  7.1 Electrical tests
  7.2 Bum-in
  7.3 Endurance
  7.4 Dry heat (stabilization bake)
  7.5 Change of temperature
  7.6 Damp heat testing
  7.7 Particle impact noise detection
  7.8 Fine leak testing
  7.9 Gross leak testing
  7.10 Resistance to soldering heat
  7.11 Termination robustness
  7.12 Acceleration
  7.13 Vibration
  7.14 Shock
  7.15 Dimensions
  7.16 Bond-pull testing
  7.17 Salt mist
  7.18 Flammability
  7.19 Solderability
  7.20 Resistance to solvents
  7.21 Internal visual inspection
  7.22 External visual inspection
  7.23 Radiographic inspection
  7.24 Acceptance to dispatch

This checklist is intended for the use of a hybrid microcircuit manufacturer's internal assessment team. It will provide the hybrid manufacturer and the ONS with ongoing information on process control demonstrating compliance with EN 165000-1. It is not intended to include Quality System requirements.