Introduction
1 Scope
2 Normative references
3 Terms, definitions and abbreviated terms
3.1 Terms and definitions
3.2 Abbreviated terms
4 Principles and prerequisites of reliable soldered
connections
4.1 Principles
4.2 Prerequisites
5 Preparatory conditions
5.1 Facility cleanliness
5.2 Environmental conditions
5.3 Precautions against static charges
5.4 Lighting requirements
5.5 Equipment and tools
5.5.1 Brushes
5.5.2 Files
5.5.3 Cutters and pliers
5.5.4 Bending tools
5.5.5 Clinching tools
5.5.6 Insulation strippers
5.5.7 Soldering irons and resistance soldering
equipment
5.5.8 Non-contact heat sources
5.5.9 Soldering tools
5.5.10 Defective or uncalibrated equipment or
tools
6 Materials selection
6.1 Solder
6.1.1 Form
6.1.2 Composition
6.1.3 Melting temperatures and choice
6.2 Flux
6.2.1 Rosin-based fluxes
6.2.2 Corrosive acid fluxes
6.3 Solvents
6.3.1 Acceptable solvents
6.3.2 Drying
6.4 Flexible insulation materials
6.5 Terminals
6.5.1 Preferred terminals
6.5.2 Tin-, silver- and gold-plated terminals
6.5.3 Shape of terminals
6.6 Wires
6.7 PCBs
6.7.1 Boards
6.7.2 Plated-through holes
6.7.3 Tin-lead finish on conductors
6.7.4 Gold finish on conductors
6.8 Conformal coating, staking compounds and potting
materials
7 Preparation for soldering
7.1 Preparation of conductors, terminals and solder
cups
7.1.1 Insulation removal
7.1.2 Damage to insulation
7.1.3 Damage to conductors
7.1.4 Insulation clearance
7.1.5 Surface to be soldered
7.1.6 De-golding and pre-tinning of conductors
7.2 Preparation of the soldering bit
7.2.1 Inspection
7.2.2 Maintenance
7.2.3 Copper bits for special soldering applications
7.2.4 Plated bits
7.2.5 Tip in operation
7.3 Maintenance of resistance-type soldering electrodes
7.4 Handling (work station)
7.5 Storage (work station)
7.5.1 Components
7.5.2 PCBs
7.5.3 Materials requiring segregation
7.5.4 Traceability
7.6 Baking of PCBs
8 Mounting of components
8.1 General requirements
8.1.1 Introduction
8.1.2 Heavy components
8.1.3 Metal-case components
8.1.4 Glass-encased components
8.1.5 Stress relief
8.1.6 Reinforced plated-through holes
8.1.7 Lead and conductor cutting
8.1.8 Heat-generating components
8.1.9 Moulded components
8.1.10 Hook-up wire
8.1.11 Location
8.1.12 Conformal coating, cementing and encapsulation
8.2 Lead bending requirements
8.2.1 General
8.2.2 Components with leads terminating on the
opposite side of a PCB
8.2.3 Components with leads terminating on the
same side of a PCB
8.2.4 Conductors terminating on both sides of a
non-plated-through hole
8.2.5 Non-bendable leads
8.3 Mounting of terminals to PCB
8.3.1 General
8.3.2 Methods of attachment
8.4 Lead attachment to PCBs
8.4.1 General
8.4.2 Lead access holes
8.4.3 Clinched leads
8.4.4 Stud leads
8.4.5 Lapped round leads
8.4.6 Lapped ribbon leads
8.4.7 Lapped round- and ribbon-lead parts with
solder connection on same side
8.5 Mounting of components to terminals
8.5.1 General
8.5.2 Special constraints
8.6 Cordwood modules
8.7 Mounting of connectors to PCBs
8.7.1 General
8.7.2 Special constraints
9 Attachment of conductors to terminals, solder cups
and cables
9.1 General
9.1.1 Conductors
9.1.2 Terminals
9.1.3 Component leads
9.2 Wire termination
9.2.1 Breakouts from cables
9.2.2 Minimum and maximum insulation clearance
9.2.3 Multiple parallel entry
9.2.4 Variations
9.2.5 Solid hook-up wire
9.2.6 Stress relief
9.2.7 Mechanical support
9.3 Turret and straight pin terminals
9.3.1 Side route
9.3.2 Bottom route
9.4 Bifurcated terminals
9.4.1 General
9.4.2 Bottom route
9.4.3 Side route
9.4.4 Top route
9.4.5 Combination of top and bottom routes
9.4.6 Combination of side and bottom routes
9.5 Hook terminals
9.6 Pierced terminals
9.7 Solder cups (connector type)
9.8 Insulation tubing application
9.9 Wire and cable interconnections
9.9.1 General
9.9.2 Preparation of wires
9.9.3 Preparation of shielded wires and cables
9.9.4 Pre-assembly
9.9.5 Soldering procedures
9.9.6 Cleaning
9.9.7 Inspection
9.9.8 Workmanship
9.9.9 Sleeving of interconnection
9.10 Connection of stranded wires to PCBs
10 Soldering to terminals and PCBs
10.1 General
10.1.1 Securing conductors
10.1.2 Insulation sleeving, potting or coating
10.1.3 Thermal shunts
10.1.4 High-voltage connections
10.2 Solder application to terminals
10.2.1 Soldering of swaged terminals onto PCBs
10.2.2 Soldering of conductors onto terminals
(except cup)
10.2.3 Soldering of conductors onto cup terminals
10.3 Solder application to PCB
10.3.1 Solder coverage
10.3.2 Solder fillets
10.3.3 Soldering of component leads to plated-through
holes
10.3.4 Solder application
10.4 Wicking
10.5 Solder rework
11 Cleaning of PCB assemblies
11.1 General
11.2 Ultrasonic cleaning
11.3 Monitoring for cleanliness
11.3.1 Cleanliness testing
11.3.2 Testing frequency
11.3.3 Test limits
11.3.4 Test methods
12 Final inspection
12.1 General
12.2 Acceptance criteria
12.3 Rejection criteria
13 Verification
13.1 General
13.2 Temperature cycling
13.3 Vibration
14 Quality assurance
14.1 General
14.2 Data
14.3 Non-conformance
14.4 Calibration
14.5 Traceability
14.6 Workmanship standards
14.7 Inspection
14.8 Operator and inspector training and certification
Annex A (informative) Typical satisfactory and
unsatisfactory solder connections