EN 60191-6-8:2001
Current
The latest, up-to-date edition.
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for glass sealed ceramic quad flatpack (G-QFP)
22-10-2001
FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Provides the common outline drawings and dimensions for all types of structures and composed material of glass sealed ceramic quad flatpack.
| Committee |
CLC/TC 47X
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| PN EN 60191-6-8 : 2002 | Identical |
| NF EN 60191-6-8 : 2002 | Identical |
| DIN EN 60191-6-8:2002-05 | Identical |
| I.S. EN 60191-6-8:2002 | Identical |
| CEI EN 60191-6-8 : 2002 | Identical |
| NBN EN 60191 6-8 : 2002 | Identical |
| BS EN 60191-6-8:2001 | Identical |
| NEN EN IEC 60191-6-8 : 2001 | Identical |
| UNE-EN 60191-6-8:2002 | Identical |
| IEC 60191-6-8:2001 | Identical |
| BS EN 62317-8:2006 | Identical |
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