EN 61188-5-5:2007

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 PQFP (square)
  4.1 Field of application
  4.2 Component descriptions
  4.3 Component dimensions
  4.4 Solder joint fillet design
  4.5 Land pattern dimensions
5 PQFP (rectangular)
  5.1 Field of application
  5.2 Component descriptions
  5.3 Component dimensions
  5.4 Solder joint fillet design
  5.5 Land pattern dimensions
6 PLQFP (square)
  6.1 Field of application
  6.2 Component descriptions
  6.3 Component dimensions
  6.4 Solder joint fillet design
  6.5 Land pattern dimensions
7 PLQFP (rectangular)
  7.1 Field of application
  7.2 Component descriptions
  7.3 Component dimensions
  7.4 Solder joint fillet design
  7.5 Land pattern dimensions
8 PTQFP (square)
  8.1 Field of application
  8.2 Component descriptions
  8.3 Component dimensions
  8.4 Solder joint fillet design
  8.5 Land pattern dimensions
Annex ZA (normative) - Normative references to international
                       publications with their corresponding
                       European publications
Bibliography

Provides information on land pattern geometries used for the surface attachment of electronic components with gull-wing leads on four sides. The intent of the information presented herein is to provide the appropriate size, shape and tolerances of surface mount land patterns to ensure sufficient area for the appropriate solder fillet, and also allow for inspection, testing and reworking of those solder joints.