• EN 61188-5-6 : 2003

    Current The latest, up-to-date edition.

    PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-6: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - CHIP CARRIERS WITH J-LEADS ON FOUR SIDES

    Available format(s): 

    Language(s): 

    Published date:  04-04-2003

    Publisher:  European Committee for Standards - Electrical

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    Table of Contents - (Show below) - (Hide below)

    INTRODUCTION
    1 Scope and object
    2 Normative references
    3 General information
      3.1 General component description
      3.2 Marking
      3.3 Carrier packaging format
      3.4 Process considerations
    4 QFJ (square)
      4.1 Introductory remark
      4.2 Component description
      4.3 Component dimensions
      4.4 Solder joint fillet design
      4.5 Land pattern dimensions
    5 QFJ (rectangular)
      5.1 Introductory remark
      5.2 Component description
      5.3 Component dimensions
      5.4 Solder joint fillet design
      5.5 Land pattern dimensions
    Annex ZA (normative) Normative references to international
             publications with their corresponding European
             publications
    Bibliography
    Figures

    Abstract - (Show below) - (Hide below)

    Provides information on land pattern geometries used for the surface attachment of electronic components with J leads on four sides.

    General Product Information - (Show below) - (Hide below)

    Committee SR 91
    Development Note To be read in conjunction with EN 61188-5-1 (05/2003)
    Document Type Standard
    Publisher European Committee for Standards - Electrical
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    J STD 001 : F REQUIREMENTS FOR SOLDERED ELECTRICAL AND ELECTRONIC ASSEMBLIES
    EN 61188-5-1 : 2002 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-1: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - GENERIC REQUIREMENTS
    EN 61760-1:2006 SURFACE MOUNTING TECHNOLOGY - PART 1: STANDARD METHOD FOR THE SPECIFICATION OF SURFACE MOUNTING COMPONENTS (SMDS)
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60191-2:2012 DB Mechanical standardization of semiconductor devices - Part 2: Dimensions
    IEC 61188-5-1:2002 Printed boards and printed board assemblies - Design and use - Part 5-1: Attachment (land/joint) considerations - Generic requirements
    IPC SM 782 : A1993 AMD 2 1999 SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD
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