EN 62137:2004
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
Environmental and endurance testing - Test methods for surface-mount boards of area array type packages FBGA, BGA, FLGA, LGA, SON and QFN
01-07-2007
05-08-2004
Specifies the test method and guidelines for evaluating the quality and reliability of boards, solder lands, solder process and solder joints of reflow solder mounted area array type packages and peripheral terminal type packages. Tests for durability against mechanical and thermal stress received during or after the mounting process of discrete semiconductor devices and of integrated circuits used mainly for industrial and consumer use equipment.
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Withdrawn
|
| Standards | Relationship |
| UNE-EN 62137:2004 | Identical |
| PNE-prEN 62137 | Identical |
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