EN 62326-4-1:1997

Current

Current The latest, up-to-date edition.

Printed boards - Part 4: Rigid multilayer printed boards with interlayer connections - Sectional specification - Section 1: Capability Detail Specification - Performance levels A, B and C

Available format(s):

Language(s):

Published date: 15-01-1997

Publisher: European Committee for Standards - Electrical

Pure ENs are not available for sale, please purchase a suitable national adoption

Table of Contents - (Show below) - (Hide below)

1 Scope
2 Normative references
3 Capability Qualifying Component (CQC)
4 Capability approval
5 Capability testing
6 Capability Test Board (CTB) descriptions
Figures
Annexes
A Acronyms related to IECQ and their explanations
B Conversion table
C Bibliography
ZA (normative) Normative references to international
publications with their corresponding European
publications

Abstract - (Show below) - (Hide below)

Relates to rigid multilayer printed boards with interlayer connections. Specifies the capability qualifying component, the characteristics to be tested, the test methods and conditions to be applied, and the requirements to be fulfilled for testing capability for performance level A, B or C.

General Product Information - (Show below) - (Hide below)

Committee	CLC/SR 91
Document Type	Standard
ISBN
Pages
Published
Publisher	European Committee for Standards - Electrical
Status	Current

National Adoptions - (Show below) - (Hide below)

Equivalent Standard(s)	Relationship
BS EN 62326-4-1:1997	Identical
I.S. EN 62326-4-1:1998	Identical
PN EN 62326-4-1 : 2002	Identical
NBN EN 62326 4-1 : 1997	Identical
DIN EN 62326-4-1:1997-08	Identical
UNE-EN 62326-4-1:1999	Identical
IEC 62326-4-1:1996	Identical
SN EN 62326-4-1 : 1997	Identical
NF EN 62326 4-1 : 1998	Identical

Standards Referenced By This Book - (Show below) - (Hide below)

BS EN 61241-18:2004	Electrical apparatus for use in the presence of combustible dust Protection by encapsulation \'mD\'
BS EN 60079-18 : 2015	EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
EN 62326-1:2002	Printed boards - Part 1: Generic specification
BS EN 62326-1:2002	Printed boards Generic specification
NF EN 61249 8-8 : 1998	MATERIALS FOR INTERCONNECTION STRUCTURES - PART 8: SECTIONAL SPECIFICATION SET FOR NON-CONDUCTIVE FILMS AND COATINGS - SECTION 8: TEMPORARY POLYMER COATINGS
BS EN 62326-4:1997	Printed boards Rigid multilayer printed boards with interlayer connections. Sectional specification
CEI EN 60079-18 : 2016	EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
CEI EN 62326-1 : 2002	PRINTED BOARDS - PART 1: GENERIC SPECIFICATION
I.S. EN 61189-3:2008	TEST METHODS FOR ELECTRICAL MATERIALS, PRINTED BOARDS AND OTHER INTERCONNECTION STRUCTURES AND ASSEMBLIES - PART 3: TEST METHODS FOR INTERCONNECTION STRUCTURES (PRINTED BOARDS)
BS EN 61249-8-8:1997	Materials for interconnection structures. Sectional specification set for non-conductive films and coatings Temporary polymer coatings
EN 61241-18:2004	Electrical apparatus for use in the presence of combustible dust - Part 18: Protection by encapsulation "mD"
BS EN 61189-3:2008	Test methods for electrical materials, printed boards and other interconnection structures and assemblies Test methods for interconnection structures (printed boards)
EN 60079-18:2015/A1:2017	EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M' (IEC 60079-18:2014/A1:2017)
I.S. EN 60079-18:2015	EXPLOSIVE ATMOSPHERES - PART 18: EQUIPMENT PROTECTION BY ENCAPSULATION 'M'
I.S. EN 62326-1:2002	PRINTED BOARDS - GENERIC SPECIFICATION
EN 61189-3:2008	Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3: Test methods for interconnection structures (printed boards)

Standards Referencing This Book - (Show below) - (Hide below)

IEC 60068-2-20:2008	Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
IEC 60249-3-3:1991	Base materials for printed circuits - Part 3: Special materials used in connection with printed circuits - Specification No. 3: Permanent polymer coating materials (solder resist) for use in the fabrication of printed boards
IEC 60068-2-38:2009	Environmental testing - Part 2-38: Tests - Test Z/AD: Composite temperature/humidity cyclic test
IEC 60068-2-3:1969	Basic environmental testing procedures - Part 2-3: Tests - Test Ca: Damp heat, steady state

Categories associated with this Standard - (Show below) - (Hide below)

Sub-Categories associated with this Standard - (Show below) - (Hide below)

Sorry this product is not available in your region.

Add To Cart