EN IEC 60286-3:2022
Current
The latest, up-to-date edition.
Packaging of components for automatic handling - Part 3: Packaging of surface mount components on continuous tapes
23-12-2022
This part of IEC 60286 is applicable to the tape packaging of electronic components without leads or with lead stumps, intended to be connected to electronic circuits. It includes only those dimensions that are essential for the taping of components intended for the above-mentioned purposes.This document also includes requirements related to the packaging of singulated die products including bare die and bumped die (flip chips).
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Standards | Relationship |
| DS/EN IEC 60286-3:2022 | Identical |
| PN-EN IEC 60286-3:2023-08 | Identical |
| CEI EN IEC 60286-3:2023 | Identical |
| SS-EN IEC 60286-3, UTG 5:2023 | Identical |
| UNE-EN IEC 60286-3:2022 | Identical |
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