EN IEC 61760-2:2021
Current
The latest, up-to-date edition.
Surface mounting technology - Part 2: Transportation and storage conditions of surface mounting devices (SMD) - Application guide
03-09-2021
This International Standard describes the transportation and storage conditions for surface mounting devices (SMDs) that are fulfilled in order to enable trouble-free processing of surface mounting devices, both active and passive. (Conditions for printed boards are not taken into consideration.)The object of this standard is to ensure that users of SMDs receive and store products tha can be further processed (e.g. positioned, soldered) without prejudice to quality and reliability. Improper transportation and storage of SMDs may cause deterioration and result in assembly problems such as poor solderability, delamination and "popcorning".
| Committee |
CLC/SR 91
|
| DocumentType |
Standard
|
| PublisherName |
European Committee for Standards - Electrical
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61760-2:2021 | Identical |
| I.S. EN IEC 61760-2:2021 | Identical |
| OVE EN IEC 61760-2:2022 10 01 | Identical |
| CEI EN IEC 61760-2:2022 | Identical |
| BS EN IEC 61760-2:2021 | Identical |
| PN-EN IEC 61760-2:2022-04 | Identical |
| UNE-EN IEC 61760-2:2021 | Identical |
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