• EN ISO 9455-14:2017

    Current The latest, up-to-date edition.

    Soft soldering fluxes - Test methods - Part 14: Assessment of tackiness of flux residues (ISO 9455-14:2017)

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    Published date:  20-09-2017

    Publisher:  Comite Europeen de Normalisation

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    Table of Contents - (Show below) - (Hide below)

    European foreword
    Foreword
    1 Scope
    2 Normative references
    3 Terms and definitions
    4 Principle
    5 Reagents and materials
    6 Apparatus
    7 Test pieces
    8 Procedure
    9 Examination of the test piece
    10 Expression of results
    11 Test report

    Abstract - (Show below) - (Hide below)

    ISO 9455-14:2017 specifies a qualitative method for the assessment of the tackiness of the residues of a soft soldering flux after a soldering process. The method is applicable to all fluxes, solder pastes and flux cored solder wires. The method is particularly appropriate for applications where flux residues are left in situ on electrical and electronic equipment.

    General Product Information - (Show below) - (Hide below)

    Committee CEN/TC 121
    Development Note Supersedes EN 29455-14. (10/2017)
    Document Type Standard
    Publisher Comite Europeen de Normalisation
    Status Current
    Supersedes

    Standards Referencing This Book - (Show below) - (Hide below)

    ISO 197-1:1983 Copper and copper alloys Terms and definitions Part 1: Materials
    ISO 9455-2:1993 Soft soldering fluxes Test methods Part 2: Determination of non-volatile matter, ebulliometric method
    ISO 9455-1:1990 Soft soldering fluxes — Test methods — Part 1: Determination of non-volatile matter, gravimetric method
    ISO 9453:2014 Soft solder alloys Chemical compositions and forms
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