ENV 1375 PT1 : 1994

Foreword
Introduction
1. Scope
2. Normative references
3. Abbreviations
4. Dimensions of card
4.1 Card width and height
4.2 Card thickness
4.3 Corners
4.4 Card edges
5. Card construction
6. Card material
7. Card characteristics
7.1 General
7.1.1 Flammability
7.1.2 Toxicity
7.1.3 Resistance to chemicals
7.1.4 Card dimensional stability with temperature and
         humidity
7.1.5 Light
7.1.6 Durability
7.1.7 Adhesion or blocking
8. Characteristics related to the integrated circuit
         cards
9. Dimensions and location of contacts
9.1 Dimensions of the contacts
9.2 Location of contacts
9.3 Assignment of the contacts
10. Electrical characteristics resistance
10.1 Static electricity resistance
10.2 Electrical resistance (of contacts)
11. Other features
Annex A (normative) Test methods for ID-000 card
A.1 Default test environment and conditioning and
         functional test
A.1.1 Default test environment and conditioning
A.1.2 Functional test
A.2 Test methods
A.2.1 Dimensions of cards
A.2.1.1 Thickness of card measurements
A.2.1.2 Height and width of card measurement
A.2.2 Resistance to chemicals
A.2.3 Card dimensional stability with temperature and
         humidity
A.2.4 Adhesion or blocking
A.2.5 Flammability
A.2.6 Location of contacts
A.2.7 Static electricity
A.2.8 Ultraviolet light
A.2.9 X-rays
A.2.10 Electrical resistance and impedance of contacts
A.2.11 Surface profile of contacts
A.2.12 Vibrations
A.2.13 Electromagnetic fields
Annex B (informative) Relationship between ID-000 and ID-1

Defines an ICC format in addition to already standardised ID-1 format. Coverage includes: card thickness, card construction, card material, resistance to chemicals, location of contacts, adhesion or blocking, static electricity resistance, and dimension of the contacts.