GEIA GEB 0002 : 2003
Current
The latest, up-to-date edition.
REDUCING THE RISK OF TIN WHISKER-INDUCED FAILURES IN ELECTRONIC EQUIPMENT
Hardcopy , PDF
English
01-01-2003
Important note : Users cannot be edited or removed once added to your Multi user PDF.
1 Scope
2 Tin Whisker Formation
3 Methods to Reduce the Risk of Tin Whisker-Induced Failures
4 Conclusions
Bibliography
Gives a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware.
| Committee |
G-12
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
Government Electronics & Information Technology Association
|
| Status |
Current
|
| ASTM B 545 : 2013 : REDLINE | Standard Specification for Electrodeposited Coatings of Tin |
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