REDUCING THE RISK OF TIN WHISKER-INDUCED FAILURES IN ELECTRONIC EQUIPMENT

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Hardcopy , PDF

Language(s)

English

Published date

01-01-2003

Publisher

Government Electronics & Information Technology Association

€59.86

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1 Scope
2 Tin Whisker Formation
3 Methods to Reduce the Risk of Tin Whisker-Induced Failures
4 Conclusions
Bibliography

Gives a brief description of tin whisker formation and describes various methods recommended by government and industry to reduce the risk of tin whisker-induced failures in electronic hardware.

Committee	G-12
DocumentType	Standard
Pages	22
PublisherName	Government Electronics & Information Technology Association
Status	Current

ASTM B 545 : 2013 : REDLINE

Standard Specification for Electrodeposited Coatings of Tin

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GEIA GEB 0002 : 2003

REDUCING THE RISK OF TIN WHISKER-INDUCED FAILURES IN ELECTRONIC EQUIPMENT

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GEIA GEB 0002 : 2003

REDUCING THE RISK OF TIN WHISKER-INDUCED FAILURES IN ELECTRONIC EQUIPMENT

Table of Contents

Abstract

General Product Information

Standards Referencing This Book

Industry

Sub-Industry