HD 307.3.11 : 200S1
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SPECIFICATION FOR SOLVENTLESS POLYMERISABLE RESINOUS COMPOUNDS USED FOR ELECTRICAL INSULATION - SPECIFICATIONS FOR INDIVIDUAL MATERIALS - EPOXY RESIN-BASED COATING POWDERS
Published date
12-01-2013
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Contains the general and special requirements for thermosetting epoxy resin-based coating powders being applied by coating processes such as fluidized air bed, powder spraying and electrostatic coating.
| Committee |
SR 15
|
| DocumentType |
Standard
|
| PublisherName |
Harmonization Documents
|
| Status |
Current
|
| Standards | Relationship |
| BS 5664-3.11:1995 | Identical |
| NFC 26 163-11 : 1993 | Identical |
| UNE 21340-3-11:1993 | Similar to |
| VDE 0355-311 : DRAFT 90 | Identical |
| IEC 60455-3-11:1988 | Identical |
| CEI 15-61 : 1997 | Identical |
| VDE 0368 : 1972 | Identical |
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