I.S. EN 165000-3:1998
Current
The latest, up-to-date edition.
FILM AND HYBRID INTEGRATED CIRCUITS - PART 3: SELF-AUDIT CHECKLIST AND REPORT FOR FILM AND HYBRID INTEGRATED CIRCUIT MANUFACTURERS
Hardcopy , PDF
English
01-01-1998
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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1 SCOPE
2 DOCUMENT INFORMATION
2.1 Introduction and use
2.2 Related documents
3 GENERAL REQUIREMENTS
3.1 Report front sheets and authentication
3.2 Description of report/company structure
3.3 Approval information
3.4 Summary of testing
3.5 Analytical methods
3.6 Control of procurement sources and incoming material
3.7 Environmental control and static handling
3.8 Major change notification
3.9 Hybrid design
4 THICK FILM PROCESSING
4.1 Artwork & Screen fabrication
4.2 Substrates
4.3 Substrate saw or scribe and break and substrate hole
drilling
4.4 Thick film pastes and printing
4.5 Drying and firing
4.6 Resistor trimming
4.7 Inspection and test of processing
4.8 Rework
5 THIN FILM PROCESSING
5.1 Artwork and mask fabrication
5.2 Substrates
5.3 Substrate saw or scribe and break and substrate hole
drilling
5.4 Thin film processing materials and pattern forming
5.5 Drying and stabilization
5.6 Resistor trimming
5.7 Rework
6 HYBRID ASSEMBLY
6.1 Solder assembly
6.1.1 Kitting
6.1.2 Cleaning
6.1.3 Component placement
6.1.4 Substrate attach
6.1.5 Soldering
6.1.6 Encapsulation
6.1.7 Rework
6.1.8 Marking
6.2 Chip & Wire
6.2.1 Kitting
6.2.2 Cleaning
6.2.3 Component placement
6.2.4 Substrate attach
6.2.5 Wirebonding
6.2.6 Package seal
6.2.7 Rework
6.2.8 Marking
7 TEST AND SHIPPING
7.1 Electrical tests
7.2 Bum-in
7.3 Endurance
7.4 Dry heat (stabilization bake)
7.5 Change of temperature
7.6 Damp heat testing
7.7 Particle impact noise detection
7.8 Fine leak testing
7.9 Gross leak testing
7.10 Resistance to soldering heat
7.11 Termination robustness
7.12 Acceleration
7.13 Vibration
7.14 Shock
7.15 Dimensions
7.16 Bond-pull testing
7.17 Salt mist
7.18 Flammability
7.19 Solderability
7.20 Resistance to solvents
7.21 Internal visual inspection
7.22 External visual inspection
7.23 Radiographic inspection
7.24 Acceptance to dispatch
Specifies the hybrid manufacturer and the ONS with ongoing information on process control demonstrating compliance with EN 165000-1.
| DocumentType |
Standard
|
| Pages |
102
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| EN 165000-3:1996 | Identical |
| SN EN 165000-3 : 1996 | Identical |
| NEN EN 165000-3 : 1996 | Identical |
| DIN EN 165000-3:1996-11 | Identical |
| BS EN 165000-3:1996 | Identical |
| EN 100012 : 1995 | HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: BASIC SPECIFICATION: X-RAY INSPECTION OF ELECTRONIC COMPONENTS |
| EN 100114-1 : 1996 | RULE OF PROCEDURE - QUALITY ASSESSMENT PROCEDURES - PART 1: CECC REQUIREMENTS FOR THE APPROVAL OF AN ORGANIZATION |
| CECC 00016 : 1990 | BASIC SPECIFICATION - BASIC REQUIREMENTS FOR THE USE OF STATISTICAL PROCESS CONTROL (SPC) IN THE CECC SYSTEM |
| EN 165000-1:1996 | Film and hybrid integrated circuits - Part 1: Generic specification - Capability approval procedure |
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