I.S. EN 60191-6-2:2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-2: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR 1,50 MM, 1,27 MM AND 1,00 MM PITCH BALL AND COLUMN TERMINAL PACKAGES
Hardcopy , PDF
English
01-01-2002
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Definitions
4 Ball terminal packages, 1,50 mm, 1,27 mm and 1,00 mm
pitch
5 Column terminal packages, 1,50 mm, 1,27 mm and
1,00 mm pitch
Annex ZA (normative) Normative references to international
publications with their corresponding European
publications
Gives the requirements for the preparation of drawings of integrated circuit outlines for the various ball terminal packages, e.g. ceramic ball grid array (C-BGA), plastic ball grid array (P-BGA), tape ball grid array (T-BGA) and others as well as column terminal packages, e.g. ceramic column grid array (C-CGA).
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
22
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| UNE-EN 60191-6-2:2003 | Identical |
| BS EN 60191-6-2:2002 | Identical |
| NF EN 60191-6-2 : 2002 | Identical |
| DIN EN 60191-6-2:2002-09 | Identical |
| IEC 60191-6-2:2001 | Identical |
| EN 60191-6-2:2002 | Identical |
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