I.S. EN 60191-6-8:2002
Current
The latest, up-to-date edition.
MECHANICAL STANDARDIZATION OF SEMICONDUCTOR DEVICES - PART 6-8: GENERAL RULES FOR THE PREPARATION OF OUTLINE DRAWINGS OF SURFACE MOUNTED SEMICONDUCTOR DEVICE PACKAGES - DESIGN GUIDE FOR GLASS SEALED CERAMIC QUAD FLATPACK (G-QFP)
Hardcopy , PDF
English
01-01-2002
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
1 Scope and object
2 Normative references
3 Definitions
4 Numbering of the pins
Annex ZA (normative) Normative references to
international publications with their
corresponding European publications
Gives the common outline drawings and dimensions for all types of structures and composed materials of glass sealed ceramic quad flatpack.
| DevelopmentNote |
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
18
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| NF EN 60191-6-8 : 2002 | Identical |
| DIN EN 60191-6-8:2002-05 | Identical |
| EN 60191-6-8:2001 | Identical |
| BS EN 60191-6-8:2001 | Identical |
| UNE-EN 60191-6-8:2002 | Identical |
| IEC 60191-6-8:2001 | Identical |
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