I.S. EN 60539-2:2004

FOREWORD
1 General
   1.1 Scope
   1.2 Normative references
   1.3 Information to be given in a detail specification
   1.4 Terminology
2 Preferred ratings and characteristics
   2.1 Tolerances on rated zero-power resistance
   2.2 Climatic categories
3 Quality assessment procedures
   3.1 Primary stage of manufacture
   3.2 Structurally similar components
   3.3 Qualification approval procedures
   3.4 Quality conformance inspection
   3.5 Quality conformance inspection
4 Test and measurement procedures
   4.1 Mounting
   4.2 Drying and recovery
   4.3 Visual examination and check of dimensions
   4.4 Electrical tests
   4.5 Thermal tests
   4.6 Resistance to soldering heat
   4.7 Solderability
   4.8 Rapid change of temperature
   4.9 Thermal shock
   4.10 Climatic sequence
   4.11 Damp heat, steady state
   4.12 Endurance
   4.13 Shear (adhesion) test
   4.14 Substrate bending test
   4.15 Component solvent resistance
   4.16 Solvent resistance of marking
Annex A (normative) - Guide for the specification and coding
        of dimensions of surface mount negative temperature
        coefficient thermistors
Annex ZA (normative) - Normative references to international
         publications with their corresponding European
         publications

Applies to surface mount directly heated negative temperature coefficient thermistors, typically made from transition metal oxide materials with semiconducting properties. These thermistors have metallized connecting pads or soldering strips and are intended to be mounted directly on to substrates for hybrid circuits or on to printed boards.