I.S. EN 60749-22:2003
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH
Hardcopy , PDF
English
01-01-2003
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
INTRODUCTION
1 Scope and object
2 Methods A and B (see also annex A)
3 Method C
4 Method D
5 Methods E and F
6 Method G: Wire ball shear test
7 Information to be given in the relevant specification
Annex A (normative) - Guidance
Pertains to semiconductor devices (discrete devices and integrated circuits). Also measure bond strength or determine compliance with specified bond strength requirements.
| DevelopmentNote |
NSAI reissued 2003 PDF dated 19.02.2015 with IEC Corrigenda incorporated. (06/2017)
|
| DocumentType |
Standard
|
| Pages |
50
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| BS EN 60749-22:2003 | Identical |
| NBN EN 60749-22 : 2004 | Identical |
| DIN EN 60749-22:2003-12 | Identical |
| EN 60749-22:2003 | Identical |
| NF EN 60749-22 : 2003 | Identical |
| UNE-EN 60749-22:2004 | Identical |
| IEC 60749-22:2002 | Identical |
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