Skip to content
Please enter a keyword to search
  • Preview

    I.S. EN 60749-22:2003

    Current The latest, up-to-date edition.

    SEMICONDUCTOR DEVICES - MECHANICAL AND CLIMATIC TEST METHODS - PART 22: BOND STRENGTH

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2003

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

    Add To Cart

    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    INTRODUCTION
    1 Scope and object
    2 Methods A and B (see also annex A)
    3 Method C
    4 Method D
    5 Methods E and F
    6 Method G: Wire ball shear test
    7 Information to be given in the relevant specification
    Annex A (normative) - Guidance

    Abstract - (Show below) - (Hide below)

    Pertains to semiconductor devices (discrete devices and integrated circuits). Also measure bond strength or determine compliance with specified bond strength requirements.

    General Product Information - (Show below) - (Hide below)

    Development Note NSAI reissued 2003 PDF dated 19.02.2015 with IEC Corrigenda incorporated. (06/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current
    View more information

    • Access your standards online with a subscription

      Features

      • Simple online access to standards, technical information and regulations
      • Critical updates of standards and customisable alerts and notifications
      • Multi - user online standards collection: secure, flexibile and cost effective