I.S. EN 61188-5-8:2008

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 General information
  3.1 General component description
  3.2 Marking
  3.3 Carrier packaging format
  3.4 Process considerations
4 BGA (square)
  4.1 Field of application
  4.2 Component descriptions
      4.2.1 Basic construction
      4.2.2 Termination materials
      4.2.3 Marking
      4.2.4 Carrier package format
      4.2.5 Process considerations
  4.3 Component dimensions (square)
      4.3.1 PBGA 1,5 mm pitch component
            dimensions (square)
      4.3.2 PBGA 1,27 mm pitch component
            dimensions (square)
      4.3.3 PBGA 1,00 mm pitch component
            dimensions (square)
  4.4 Solder joint fillet design
      4.4.1 Solder joint fillet design - Non-collapsing,
            collapsing (level 3)
  4.5 Land pattern dimensions
      4.5.1 PBGA 1,5 mm pitch land pattern
            dimensions (square)
      4.5.2 PBGA 1,27 mm pitch land pattern
            dimensions (square)
      4.5.3 PBGA 1,00 mm pitch land pattern
            dimensions (square)
5 FBGA (square)
6 BGA (rectangular)
  6.1 Field of application
  6.2 Component descriptions
      6.2.1 Basic construction
      6.2.2 Termination materials
      6.2.3 Marking
      6.2.4 Carrier package format
      6.2.5 Process considerations
  6.3 Component dimensions (rectangular)
  6.4 Solder joint fillet design
      6.4.1 Solder joint fillet design - Collapsing
            (level 3)
      6.4.2 Land approximation
      6.4.3 Total variation
  6.5 Land pattern dimensions
7 FBGA (rectangular)
8 CGA
9 LGA
Annex ZA (normative) Normative references to international
                     publications with their corresponding
                     European publications
Bibliography

Describes information on land pattern geometries used for the surface attachment of electronic components with area array terminations in the form of solder balls, solder columns or protective coated lands.