I.S. EN 61709:2017&AC:2019
Current
The latest, up-to-date edition.
Electric components - Reliability - Reference conditions for failure rates and stress models for conversion (IEC 61709:2017/COR1:2019)
Hardcopy , PDF
English - French
05-12-2019
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Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms, definitions and symbols
4 Context and conditions
5 Generic reference conditions and stress models
6 Integrated semiconductor circuits
7 Discrete semiconductors
8 Optoelectronic components
9 Capacitors
10 Resistors and resistor networks
11 Inductors, transformers and coils
12 Microwave devices
13 Other passive components
14 Electrical connections
15 Connectors and sockets
16 Relays
17 Switches and push-buttons
18 Signal and pilot lamps
19 Printed circuit boards (PCB)
20 Hybrid circuits
Annex A (normative) Failure modes of components
Annex B (informative) Thermal model for semiconductors
Annex C (informative) Failure rate prediction
Annex D (informative) Considerations on mission profile
Annex E (informative) Useful life models
Annex F (informative) Physics of failure
Annex G (informative) Considerations for the design of a data base on failure rates
Annex H (informative) Potential sources of failure rate data and methods of selection
Annex I (informative) Overview of component classification
Annex J (informative) Presentation of component reliability data
Annex K (informative) Examples
Bibliography
This document gives guidance on the use of failure rate data for reliability prediction of electric components used in equipment.
| Committee |
TC 56
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-3902-5
|
| Pages |
0
|
| ProductNote |
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61709:2017 | Identical |
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