I.S. EN 62047-12:2011
Current
The latest, up-to-date edition.
SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 12: BENDING FATIGUE TESTING METHOD OF THIN FILM MATERIALS USING RESONANT VIBRATION OF MEMS STRUCTURES (IEC 62047-12:2011)
Hardcopy , PDF
English
01-01-2011
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test equipment
5 Specimen
6 Test conditions
7 Initial measurement
8 Test
9 Test report
Annex A (informative) - Example of testing using an
electrostatic device with an integrated actuation
component and displacement detection component
Annex B (informative) - Example of testing using an external
drive and a device with an integrated strain gauge
for detecting displacement
Annex C (informative) - Example of electromagnetic drive
out-of-plane vibration test (external drive
vibration test)
Annex D (informative) - Theoretical expression on fatigue
life of brittle materials based on Paris' law
and Weibull distribution
Annex E (informative) - Analysis examples
Bibliography
Annex ZA (normative) - Normative references to international
publications with their corresponding European
publications
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