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I.S. EN 62047-22:2014

Current

Current

The latest, up-to-date edition.

SEMICONDUCTOR DEVICES - MICROELECTROMECHANICAL DEVICES - PART 22: ELECTROMECHANICAL TENSILE TEST METHOD FOR CONDUCTIVE THIN FILMS ON FLEXIBLE SUBSTRATES

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

01-01-2014

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
1 Scope
2 Normative references
3 Terms, definitions, symbols
  and designations
4 Test piece
5 Testing method and test apparatus
6 Test report
Annex ZA (normative) - Normative references to
         international publications with their
         corresponding European publications

Defines a tensile test method to measure electromechanical properties of conductive thin micro-electromechanical systems (MEMS) materials bonded on non-conductive flexible substrates.

DevelopmentNote
For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
DocumentType
Standard
Pages
32
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN 62047-22:2014 Identical

IEC 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
EN 62047-2:2006 Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials
IEC 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
IEC 62047-3:2006 Semiconductor devices - Micro-electromechanical devices - Part 3: Thin film standard test piece for tensile testing
EN 62047-3 : 2006 SEMICONDUCTOR DEVICES - MICRO-ELECTROMECHANICAL DEVICES - PART 3: THIN FILM STANDARD TEST PIECE FOR TENSILE TESTING
EN 62047-8:2011 Semiconductor devices - Micro-electromechanical devices - Part 8: Strip bending test method for tensile property measurement of thin films
ISO 527-3:1995 Plastics Determination of tensile properties Part 3: Test conditions for films and sheets
EN ISO 527-3:1995/AC:2002 PLASTICS - DETERMINATION OF TENSILE PROPERTIES - PART 3: TEST CONDITIONS FOR FILMS AND SHEETS

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