I.S. EN 62137-4:2014
Current
The latest, up-to-date edition.
ELECTRONICS ASSEMBLY TECHNOLOGY - PART 4: ENDURANCE TEST METHODS FOR SOLDER JOINT OF AREA ARRAY TYPE PACKAGE SURFACE MOUNT DEVICES
Hardcopy , PDF
English
01-01-2014
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms definitions and abbreviations
4 General
5 Test apparatus and materials
6 Specimen preparation
7 Temperature cycling test
8 Temperature cycling life
9 Items to be specified in the relevant
product specification
Annex A (informative) - Acceleration of the
temperature cycling test for solder joints
Annex B (informative) - Electrical continuity test
for solder joints of the package
Annex C (informative) - Reflow solderability test
method for package and test substrate land
Annex D (informative) - Test substrate
design guideline
Annex E (informative) - Heat resistance to reflow
soldering for test substrate
Annex F (informative) - Pull strength measurement
method for the test substrate land
Annex G (informative) - Standard mounting
process for the packages
Annex H (informative) - Mechanical stresses
to the packages
Bibliography
Annex ZA (normative) - Normative references
to international publications with their
corresponding European publications
Defines the test method for the solder joints of area array type packages mounted on the printed wiring board to evaluate solder joint durability against thermo-mechanical stress.
| DevelopmentNote |
Supersedes I.S. EN 62137. (03/2015) For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
|
| DocumentType |
Standard
|
| Pages |
100
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| BS EN 62137-4:2014 | Equivalent |
| EN 62137-4:2014 | Equivalent |
| IEC 62137-4:2014 | Equivalent |
| UNE-EN 62137-4:2014 | Equivalent |