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    I.S. EN 62572-3:2016

    Current The latest, up-to-date edition.

    FIBRE OPTIC ACTIVE COMPONENTS AND DEVICES - RELIABILITY STANDARDS - PART 3: LASER MODULES USED FOR TELECOMMUNICATION

    Available format(s):  Hardcopy, PDF

    Language(s):  English

    Published date:  01-01-2016

    Publisher:  National Standards Authority of Ireland

    For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
    Only cited Standards give presumption of conformance to New Approach Directives/Regulations.

    Dates of withdrawal of national standards are available from NSAI.

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    Table of Contents - (Show below) - (Hide below)

    National Foreword
    FOREWORD
    INTRODUCTION
    1 Scope
    2 Normative references
    3 Terms, definitions, symbols and
      abbreviations
    4 Laser reliability and quality assurance
      procedure
    5 Tests
    6 Activities
    Annex A (informative) - Guidance on testing
            in Table 1 and Table 2
    Bibliography
    Annex ZA (normative) - Normative references to
             international publications with their
             corresponding European publications

    Abstract - (Show below) - (Hide below)

    Specifies reliability assessment of laser modules used for telecommunication.

    General Product Information - (Show below) - (Hide below)

    Development Note For CENELEC adoptions of IEC publications, please check www.iec.ch to be sure that you have any corrigenda that may apply. (01/2017)
    Document Type Standard
    Publisher National Standards Authority of Ireland
    Status Current

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 60749-8:2002 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
    MIL-STD-883 Revision K:2016 TEST METHOD STANDARD - MICROCIRCUITS
    IEC 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    EN 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    EN 60749-11:2002 Semiconductor devices - Mechanical and climatic test methods - Part 11: Rapid change of temperature - Two-fluid-bath method
    IEC 60749-26:2013 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    EN 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC 60747-1:2006+AMD1:2010 CSV Semiconductor devices - Part 1: General
    EN 60749-8:2003 Semiconductor devices - Mechanical and climatic test methods - Part 8: Sealing
    IEC 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    EN 60749-6:2017 Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature
    EN 60749-26:2014 Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 60749-10:2002 Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock
    IEC TR 62572-2:2008 Fibre optic active components and devices - Reliability standards - Part 2: Laser module degradation
    EN 60749-25:2003 Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    EN 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
    EN 60749-12:2002 Semiconductor devices - Mechanical and climatic test methods - Part 12: Vibration, variable frequency
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