I.S. EN IEC 60749-10:2022
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
Hardcopy , PDF
English
06-09-2022
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Apparatus
5 Procedure
6 Failure criteria
7 Summary
Bibliography
Figure 1 – Live-bug orientation with solder spheres of device facing downward in either free or mounted state
Figure 2 – Dead-bug orientation with solder spheres of device facing upward in either free or mounted state
Table 1 – Device or subassembly free state test levels
Table 2 – Subassembly mounted state test levels
This part of IEC 60749 is intended to evaluate devices in the free state and assembled to printed wiring boards for use in electrical equipment.
| DocumentType |
Standard
|
| ISBN |
978-2-8322-1100-4
|
| Pages |
11
|
| ProductNote |
This standard also Refers to JESD22-B110,JESD51-9,JESD51-10, This standard also identical to EN IEC 60749-10
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-10:2022 | Identical |
| EN IEC 60749-10:2022 | Equivalent |
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