I.S. EN IEC 60749-10:2022
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 10: Mechanical shock - device and subassembly
Hardcopy , PDF
English
09-06-2022
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Apparatus
5 Procedure
6 Failure criteria
7 Summary
Bibliography
Figure 1 – Live-bug orientation with solder spheres of device facing downward in either free or mounted state
Figure 2 – Dead-bug orientation with solder spheres of device facing upward in either free or mounted state
Table 1 – Device or subassembly free state test levels
Table 2 – Subassembly mounted state test levels
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