I.S. EN IEC 60749-15:2020
Current
The latest, up-to-date edition.
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020)
Hardcopy , PDF
English
12-10-2020
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Test apparatus
5 Materials
6 Procedure
7 Summary
Bibliography
This part of IEC 60749 describes a test used to determine whether encapsulated solid state devices used for through-hole mounting can withstand the effects of the temperature to which they are subjected during soldering of their leads by using wave soldering.
| Committee |
TC 47
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-8604-3
|
| Pages |
32
|
| ProductNote |
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 60749-15:2020 | Identical |
| EN IEC 60749-15:2020 | Identical |
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