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I.S. EN IEC 61189-5-301:2021

Current

Current

The latest, up-to-date edition.

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

17-05-2021

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

€59.00
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FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Powder particle size distribution measurement
5 Solder paste viscosity
6 Printability test
7 Slump test
8 Reflow test
9 High temperature observation test
Annex A (informative) Example of the test report on powder particle size distribution measurement
Annex B (informative) Example of the test report on viscosity characteristics
Annex C (informative) Example of the test report on printability test
Annex D (informative) Example of the test report on slump test
Annex E (informative) Example of the test report on reflow test
Annex F (informative) Example of the test report on high temperature observation test
Annex G (informative) Example pictures of the printing and reflow test

This part of IEC 61189 specifies methods for testing the characteristics of soldering paste using fine solder particles (hereinafter referred to as solder paste).

Committee
TC 91
DocumentType
Test Method
ISBN
978-2-8322-9534-2
Pages
78
ProductNote
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
IEC 61189-5-301:2021 Identical
EN IEC 61189-5-301:2021 Identical

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