I.S. EN IEC 61189-5-301:2021
Current
The latest, up-to-date edition.
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-301: General test methods for materials and assemblies - Soldering paste using fine solder particles
Hardcopy , PDF
English
17-05-2021
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Powder particle size distribution measurement
5 Solder paste viscosity
6 Printability test
7 Slump test
8 Reflow test
9 High temperature observation test
Annex A (informative) Example of the test report on powder particle size distribution measurement
Annex B (informative) Example of the test report on viscosity characteristics
Annex C (informative) Example of the test report on printability test
Annex D (informative) Example of the test report on slump test
Annex E (informative) Example of the test report on reflow test
Annex F (informative) Example of the test report on high temperature observation test
Annex G (informative) Example pictures of the printing and reflow test
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