I.S. EN IEC 61760-1:2020
Current
The latest, up-to-date edition.
Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
Hardcopy , PDF
English
12-10-2020
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Requirements for component design and component specifications
5 Assembly processes
6 Soldering
7 Conductive glue bonding
8 Sintering
9 Solderless interconnection
Annex A (informative) Details on compliance information
Bibliography
This part of IEC 61760 defines requirements for component specifications of electronic components that are intended for usage in surface mounting technology.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-8588-6
|
| Pages |
102
|
| ProductNote |
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document. THIS STANDARD IS ALSO REFERS TO ISO 25178, JEDEC SPP-024
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 61760-1:2020 | Identical |
| EN IEC 61760-1:2020 | Identical |
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