I.S. EN IEC 61837-2:2018/A1:2020
Current
The latest, up-to-date edition.
Surface mounted piezoelectric devices for frequency control and selection - Standard outlines and terminal lead connections - Part 2: Ceramic enclosures
Hardcopy , PDF
English
23-11-2020
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Configuration of enclosures
5 Designation of types
6 Ceramic enclosure dimensions
7 Lead connections
8 Designation of ceramic enclosures
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Bibliography
This part of IEC 61837 deals with standard outlines and terminal lead connections as they apply to surface-mounted devices (SMD) for frequency control and selection in ceramic enclosures, and is based on IEC 61240:2016.
Committee |
TC 49
|
DocumentType |
Standard
|
ISBN |
978-2-8322-5673-2
|
Pages |
144
|
ProductNote |
The date of any NSAIprevious adoption may not matchthe date of its original CEN/CENELEC document. THIS STANDARD IS ALSO IDENTICAL TO IEC 61837-2:3.0/AMD 1:2020
|
PublisherName |
National Standards Authority of Ireland
|
Status |
Current
|
Supersedes |
Standards | Relationship |
EN IEC 61837-2:2018/A1:2020 | Identical |
IEC 61837-2:2018+AMD1:2020 CSV | Identical |
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