I.S. EN IEC 62148-21:2021
Current
The latest, up-to-date edition.
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)
Hardcopy , PDF
English
02-07-2021
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings
7 Dimensions and tolerances
Bibliography
This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA).
| Committee |
IEC/TC 86
|
| DocumentType |
Standard
|
| ISBN |
978-2-8322-9723-0
|
| Pages |
28
|
| ProductNote |
THIS STANDARD IS ALSO REFERES TO IEC TR 61931 The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| IEC 62148-21:2021 | Identical |
| EN IEC 62148-21:2021 | Identical |
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