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I.S. EN IEC 62148-21:2021

Current

Current

The latest, up-to-date edition.

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

02-07-2021

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Terminal position numbering
5 Code of package nominal dimensions
6 Symbols and drawings
7 Dimensions and tolerances
Bibliography

This part of IEC 62148 covers the design guidelines of the electrical interface for photonic integrated circuit (PIC) packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA).

Committee
IEC/TC 86
DocumentType
Standard
ISBN
978-2-8322-9723-0
Pages
28
ProductNote
THIS STANDARD IS ALSO REFERES TO IEC TR 61931 The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
PublisherName
National Standards Authority of Ireland
Status
Current
Supersedes

Standards Relationship
IEC 62148-21:2021 Identical
EN IEC 62148-21:2021 Identical

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