I.S. EN IEC 62878-1:2019
Current
The latest, up-to-date edition.
Device embedding assembly technology - Part 1: Generic specification for device embedded substrates
Hardcopy , PDF
English
30-12-2019
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Value chain
5 Safety aspects of base material and components
6 Design and structure of device embedded substrate
7 Embedding technology
8 Tests and measuring methods
9 Transportation, handling and packing material
10 General requirements
Bibliography
This part of IEC 62878 specifies the generic requirements and test methods for deviceembedded substrates.
| Committee |
TC 91
|
| DocumentType |
Test Method
|
| ISBN |
978-2-8322-7460-6
|
| Pages |
34
|
| ProductNote |
THIS STANDARD IS ALSO REFERES TO :IEC TR 62878-2-3,IEC TR 62878-2-4,J-STD 033,JPCA-EB01,IPC 7092, The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Standards | Relationship |
| IEC 62878-1:2019 | Identical |
| EN IEC 62878-1:2019 | Identical |
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