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I.S. EN IEC 62878-1:2019

Current

Current

The latest, up-to-date edition.

Device embedding assembly technology - Part 1: Generic specification for device embedded substrates

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

30-12-2019

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
INTRODUCTION
1 Scope
2 Normative references
3 Terms and definitions
4 Value chain
5 Safety aspects of base material and components
6 Design and structure of device embedded substrate
7 Embedding technology
8 Tests and measuring methods
9 Transportation, handling and packing material
10 General requirements
Bibliography

This part of IEC 62878 specifies the generic requirements and test methods for deviceembedded substrates.

Committee
TC 91
DocumentType
Test Method
ISBN
978-2-8322-7460-6
Pages
34
ProductNote
THIS STANDARD IS ALSO REFERES TO :IEC TR 62878-2-3,IEC TR 62878-2-4,J-STD 033,JPCA-EB01,IPC 7092, The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
IEC 62878-1:2019 Identical
EN IEC 62878-1:2019 Identical

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