• There are no items in your cart

I.S. EN IEC 62878-2-5:2019

Current

Current

The latest, up-to-date edition.

Device embedding assembly technology - Part 2-5: Guidelines - Implementation of a 3D data format for device embedded substrate (IEC 62878-2-5:2019)

Available format(s)

Hardcopy , PDF

Language(s)

English

Published date

25-11-2019

For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.

Only cited Standards give presumption of conformance to New Approach Directives/Regulations.


Dates of withdrawal of national standards are available from NSAI.

FOREWORD
1 Scope
2 Normative references
3 Terms and definitions
4 Data definition
5 Data organization and data description based on XML schema
Bibliography

This part of IEC 62878 specifies requirements based on XML schema that represents a design data format for device embedded substrate, which is a board comprising embedded active and passive devices whose electrical connections are made by means of a via, electroplating, conductive paste or printing of conductive material.

Committee
TC 91
DocumentType
Standard
ISBN
978-2-8322-7399-9
Pages
0
ProductNote
The date of any NSAI previous adoption may not match the date of its original CEN/CENELEC document.<br>
PublisherName
National Standards Authority of Ireland
Status
Current

Standards Relationship
EN IEC 62878-2-5:2019 Identical
IEC 62878-2-5:2019 Identical

View more information
€99.00
Excluding VAT

Access your standards online with a subscription

Features

  • Simple online access to standards, technical information and regulations.

  • Critical updates of standards and customisable alerts and notifications.

  • Multi-user online standards collection: secure, flexible and cost effective.