I.S. EN ISO 9453:2014
Withdrawn
A Withdrawn Standard is one, which is removed from sale, and its unique number can no longer be used. The Standard can be withdrawn and not replaced, or it can be withdrawn and replaced by a Standard with a different number.
View Superseded by
SOFT SOLDER ALLOYS - CHEMICAL COMPOSITIONS AND FORMS (ISO 9453:2014)
Hardcopy , PDF
30-04-2021
English
01-01-2014
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
Dates of withdrawal of national standards are available from NSAI.
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) - Comparison between alloy numbers
in ISO 9453 and short names and chemical
compositions according to IEC 61190-1-3
Annex B (informative) - Patented alloys and patent holder list
Bibliography
Defines the requirements for chemical composition for soft solder alloys containing two or more of tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| DevelopmentNote |
Supersedes I.S. EN 29453. (11/2006)
|
| DocumentType |
Standard
|
| Pages |
32
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Withdrawn
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| ONORM EN ISO 9453 : 2014 | Identical |
| NS EN ISO 9453 : 2014 | Identical |
| SN EN ISO 9453 : 2014 | Identical |
| BS EN ISO 9453:2014 | Identical |
| NEN EN ISO 9453 : 2014 | Identical |
| ISO 9453:2014 | Identical |
| DIN EN ISO 9453:2014-12 | Identical |
| UNI EN ISO 9453 : 2014 | Identical |
| EN ISO 9453:2014 | Identical |
| NBN EN ISO 9453 : 2014 | Identical |
| UNE-EN ISO 9453:2015 | Identical |
| NF EN ISO 9453 : 2014 | Identical |
| ISO 3677:2016 | Filler metal for soldering and brazing — Designation |
| IEC 61190-1-3:2007+AMD1:2010 CSV | Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solders for electronic soldering applications |
Access your standards online with a subscription
Features
-
Simple online access to standards, technical information and regulations.
-
Critical updates of standards and customisable alerts and notifications.
-
Multi-user online standards collection: secure, flexible and cost effective.