I.S. EN ISO 9453:2020
Current
The latest, up-to-date edition.
Soft solder alloys - Chemical compositions and forms (ISO 9453:2020)
Hardcopy , PDF
English
26-10-2020
For Harmonized Standards, check the EU site to confirm that the Standard is cited in the Official Journal.
Only cited Standards give presumption of conformance to New Approach Directives/Regulations.
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Foreword
Introduction
1 Scope
2 Normative references
3 Terms and definitions
4 Chemical composition
5 Forms of delivery
6 Sampling and analysis
7 Marking, labelling and packaging
Annex A (informative) Comparison between alloy numbers in this document and short names and chemical compositions according to IEC 61190-1-3
Bibliography
This document specifies the requirements for chemical composition for soft solder alloys containing two or more of: tin, lead, antimony, copper, silver, bismuth, zinc, indium and/or cadmium.
| Committee |
TC 44
|
| DocumentType |
Standard
|
| Pages |
30
|
| ProductNote |
The date of any NSAIprevious adoption may not matchthe date of its original CEN/CENELEC document.
|
| PublisherName |
National Standards Authority of Ireland
|
| Status |
Current
|
| Supersedes |
| Standards | Relationship |
| EN ISO 9453:2020 | Identical |
| ISO 9453:2020 | Identical |
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