I.S. ES 59008-5-3:2002
Current
The latest, up-to-date edition.
DATA REQUIREMENTS FOR SEMICONDUCTOR DIE - PART 5-3: PARTICULAR REQUIREMENTS AND RECOMMENDATIONS FOR DIE TYPES - MINIMALLY-PACKAGED DIE
Hardcopy , PDF
English
01-01-2002
Foreword
Introduction
1 Scope
2 Normative references
3 Definitions
4 Conformity levels
5 Specific recommendations - Design, selection, test
and quality
6 Specific recommendations - User or assembler related
issues, techniques, best practice and material selection
7 Specific recommendations - Identification, handling,
including pick and place issues, and storage
8 Specific recommendations - Thermal, including modelling
9 Specific recommendations - Electrical, including
simulation
10 Specific recommendations - Application environment
11 Summary of information requirements
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