IEC 60068-2-58:1999
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing - Part 2-58: Tests - Test Td - Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
31-12-2021
English, Spanish, Castilian
15-01-1999
Important note : Users cannot be edited or removed once added to your Multi user PDF.Provides standard procedures for determining the solderability, resistance to dissolution of metallization and resistance to soldering heat of surface mounting devices.The procedures use either a solder bath or reflow method and are applicable only to specimens or products designed to withstand short term immersion in molten solder or limited exposure to reflow system.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
17
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy | |
| Supersedes |
| Standards | Relationship |
| AS 60068.2.58-2004 | Identical |
| UNE-EN 60068-2-58:2015 | Identical |
| UNE-EN 60068-2-58:2000 | Identical |
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