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IEC 60068-2-69:1995

Superseded

Superseded

A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

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Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Superseded date

12-09-2022

Superseded by

IEC 60068-2-69:2007

Language(s)

English - French, Russian, Spanish, Castilian

Published date

08-12-1995

€155.95
Excluding VAT

Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.

Committee
TC 91
DocumentType
Standard
Pages
43
PublisherName
International Electrotechnical Committee
Status
Superseded
SupersededBy

Standards Relationship
NEN-EN-IEC 60068-2-69:2017/A1:2019 Identical
AS 60068.2.69-2004 Identical
UNE-EN 60068-2-69:1997 Identical

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