IEC 60068-2-69:1995
Superseded
Superseded
A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.
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Environmental testing - Part 2: Tests - Test Te: Solderability testing of electronic components for surface mount technology by the wetting balance method
Available format(s)
Hardcopy , PDF
Language(s)
English - French, Russian, Spanish, Castilian
Published date
08-12-1995
Publisher
Superseded date
12-09-2022
Superseded by
€164.53
Excluding VAT
Describes two wetting balance methods. These methods determine quantitatively the solderability of terminations on surface mounted devices.The procedures describe the solder bath wetting balance method and the solder globuwetting balance method and are both applicable to components with metallic termination and metallized solder pads.
| Committee |
TC 91
|
| DocumentType |
Standard
|
| Pages |
43
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Superseded
|
| SupersededBy |
| Standards | Relationship |
| NEN-EN-IEC 60068-2-69:2017/A1:2019 | Identical |
| AS 60068.2.69-2004 | Identical |
| UNE-EN 60068-2-69:1997 | Identical |
| BS EN 60068-2-69:1996 | Identical |
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