• IEC 60115-1:2008

    Superseded A superseded Standard is one, which is fully replaced by another Standard, which is a new edition of the same Standard.

    Fixed resistors for use in electronic equipment - Part 1: Generic specification

    Available format(s):  Hardcopy, PDF, PDF 3 Users, PDF 5 Users, PDF 9 Users

    Superseded date:  31-12-2021

    Language(s):  English, English - French

    Published date:  21-07-2008

    Publisher:  International Electrotechnical Committee

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    Table of Contents - (Show below) - (Hide below)

    FOREWORD
    1 General
      1.1 Scope
      1.2 Normative references
    2 Technical data
      2.1 Units and symbols
      2.2 Terms and definitions
      2.3 Preferred values
      2.4 Marking
      2.5 Coding
      2.6 Packaging
      2.7 Storage
      2.8 Transportation
    3 Quality assessment procedures
    4 Test and measurement procedures
      4.1 General
      4.2 Standard atmospheric conditions
      4.3 Drying
      4.4 Visual examination and checking of dimensions
      4.5 Resistance
      4.6 Insulation resistance
      4.7 Voltage proof
      4.8 Variation of resistance with temperature
      4.9 Reactance
      4.10 Non-linear properties
      4.11 Voltage coefficient
      4.12 Noise
      4.13 Short time overload
      4.14 Temperature rise
      4.15 Robustness of the resistor body
      4.16 Robustness of terminations
      4.17 Solderability
      4.18 Resistance to soldering heat
      4.19 Rapid change of temperature
      4.20 Bump
      4.21 Shock
      4.22 Vibration
      4.23 Climatic sequence
      4.24 Damp heat, steady state
      4.25 Endurance
      4.26 Accidental overload test
      4.27 Single-pulse high-voltage overload test
      4.28 Periodic-pulse high-voltage overload test
      4.29 Component solvent resistance
      4.30 Solvent resistance of marking
      4.31 Mounting of surface mount resistors
      4.32 Shear test
      4.33 Substrate bending test
      4.34 Corrosion
      4.35 Flammability
      4.36 Operation at low temperature
      4.37 Damp heat, steady state, accelerated
      4.38 Electrostatic discharge
      4.39 Periodic-pulse overload test
      4.40 Whisker growth test
      4.41 Hydrogen sulphide test
    Annex A (normative) Interpretation of sampling plans
            and procedures as described in IEC 60410 for
            use within the IECQ system
    Annex B (normative) Rules for the preparation of detail
            specifications for resistors and capacitors for
            electronic equipment for use within the
            IECQ system
    Annex C (informative) Example of test equipment for the
            periodic-pulse high-voltage overload test
    Annex D (normative) Layout of the first page of a PCP/CQC
            specification
    Annex E (normative) Requirements for capability approval
            test report
    Annex F (informative) Letter symbols and abbreviations
    Annex G (informative) Index table for test and measurement
            procedures
    Annex Q (normative) Quality assessment procedures

    Abstract - (Show below) - (Hide below)

    IEC 60115-1:2008 is a generic specification and is applicable to fixed resistors for use in electronic equipment. It establishes standard terms, inspection procedures and methods of test for use in sectional and detail specifications of electronic components for quality assessment or any other purpose.This standard cancels and replaces IEC 61045-1 (1991), IEC 61045-2 (1991) and IEC 61045-2-1 (1991). This edition contains the following significant technical changes with respect to the previous edition:a) implementation of Annex Q which replaces Clause 3;b) addition of new tests procedures in 4.34 through 4.38; c) removal of the property "temperature characteristics" from 4.8; d) introduction of a new system of test severities for the shear test in 4.32; e) introduction of new bias voltages for the damp heat steady-state test in 4.24;f) furthermore, this fourth edition cancels and replaces the third edition published in 1999 and constitutes minor revisions related to tables, figures and references.

    General Product Information - (Show below) - (Hide below)

    Committee TC 40
    Development Note Supersedes IEC 61045-1, IEC 61045-2 and IEC 61045-2-1. (10/2009) A Bilingual edition has been published on 30/07/2013. (07/2013) Stability Date: 2018. (09/2017)
    Document Type Standard
    Publisher International Electrotechnical Committee
    Status Superseded
    Superseded By
    Supersedes

    Standards Referenced By This Book - (Show below) - (Hide below)

    BS EN 140100 : 2008 SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS
    NF EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    BS EN 60115-2:2015 Fixed resistors for use in electronic equipment Sectional specification: Leaded fixed low power film resistors
    CEI EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    14/30312344 DC : 0 PD IEC/PAS 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    CEI EN 60115-2 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    CEI EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    10/30237986 DC : 0 BS EN 140401-804 - DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    08/30186808 DC : DRAFT JULY 2008 BS EN 140401 - BLANK DETAIL SPECIFICATION - FIXED LOW POWER NON-WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS
    BS EN 60115-8 : 2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    CEI EN 60115-8 : 2013 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    BS EN 140401-802 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    NF EN 60115-8-1 : 2016 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    BS PD ISO/IEC PAS 60127-8 : 2014 MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    BS EN 140401-801 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    BS EN 140401-803 : 2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    BS PD IEC TR 63091 : 2017 STUDY FOR THE DERATING CURVE OF SURFACE MOUNT FIXED RESISTORS - DERATING CURVES BASED ON TERMINAL PART TEMPERATURE
    BS EN 60115-9-1 : 2004 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9-1: BLANK DETAIL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS - ASSESSMENT LEVEL EZ
    14/30311384 DC : 0 BS EN 60115-2:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    BS EN 60115-9 : 2004 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS
    07/30161526 DC : 0 BS EN 60115-8 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS
    I.S. EN 61188-5-2:2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    BS EN 60115-8-1 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    09/30209389 DC : 0 BS EN 60115-8-1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION - FIXED CHIP RESISTORS - ASSESSMENT LEVEL E
    BS CECC 41000(1977) : 1977 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS: GENERIC SPECIFICATION FOR POTENTIOMETERS
    IEC TR 63091:2017 Study for the derating curve of surface mount fixed resistors - Derating curves based on terminal part temperature
    I.S. EN 60115-2:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    06/30155922 DC : 0 BS EN 140100 - SECTIONAL SPECIFICATION - FIXED LOW POWER FILM RESISTORS
    06/30155911 DC : DRAFT SEP 2006 BS EN 140401-801 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    IEC 60115-5:1982 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - SECTIONAL SPECIFICATION: FIXED PRECISION RESISTORS
    BS CECC40000(1980) : 1980 HARMONIZED SYSTEM OF QUALITY ASSESSMENT FOR ELECTRONIC COMPONENTS. GENERIC SPECIFICATION: FIXED RESISTORS
    16/30338234 DC : 0 BS EN 60127-8 - MINIATURE FUSES - PART 8: FUSE RESISTORS WITH PARTICULAR OVERCURRENT PROTECTION
    06/30155905 DC : DRAFT SEP 2006 BS EN 140401-803 - DETAIL SPECIFICATION - FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    09/30207307 DC : 0 BS EN 60115-2 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: FIXED LOW-POWER NON-WIREWOUND RESISTORS
    05/30129971 DC : DRAFT FEB 2005 EN 140402-801 - DETAIL SPECIFICATION - FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    CEI EN 60115-9-1 : 2005 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9-1: BLANK DETAIL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS - ASSESSMENT LEVEL EZ
    14/30317306 DC : 0 BS EN 60115-8-1:2014+A1 - FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    IEC 60115-7-1:1984 Fixed resistors for use in electronic equipment. Part 7: Blank detail specifications: Fixed resistors networks in which not all resistors are individually measurable. Assessment level E
    BS EN 140101:2008 Blank Detail Specification. Fixed low power film resistors
    IEC 60115-5-101:1995 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - DETAIL SPECIFICATION: FIXED PRECISION WIREWOUND RESISTORS WITH SOLDERABLE AXIAL WIRE LEADS - STABILITY CLASS 0.1% - ASSESSMENT LEVEL E
    IEC 60115-5-1:1983 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - BLANK DETAIL SPECIFICATION: FIXED PRECISION RESISTORS. ASSESSMENT LEVEL E
    I.S. EN 140402:2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    NF EN 140401-802 : 2008 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1, 2
    I.S. EN 60127-4:2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES (IEC 60127-4:2005 (EQV))
    BS EN 140402 : 2015 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 140401-804:2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    I.S. EN 140101-806:2009 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
    I.S. EN 60115-8:2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009 (MOD))
    I.S. EN 60115-8-1:2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G
    BS EN 60127-4 : 2005 MINIATURE FUSES - PART 4: UNIVERSAL MODULAR FUSE-LINKS (UMF) - THROUGH-HOLE AND SURFACE MOUNT TYPES
    I.S. EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    I.S. EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    BS EN 140101-806 : 2008 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
    IEC 61045-2:1991 Fixed film resistor networks for use in electronic equipment - Part 2: Sectional specification for film resistor networks of assessed quality on the basis of the capability approval procedure
    BS EN 140401 : 2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    BS EN 140401-804 : 2011 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    CEI EN 60115-9 : 2005 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS
    EN 140401-802:2007/A3:2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    NF EN 60115-2 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS
    I.S. EN 60115-9-1:2004 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9-1: BLANK DETAIL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS - ASSESSMENT LEVEL EZ
    IEC 60115-7:1984 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - SECTIONAL SPECIFICATION: FIXED RESISTOR NETWORKS IN WHICH NOT ALL RESISTORS ARE INDIVIDUALLY MEASURABLE
    13/30283837 DC : 0 BS EN 62812 - METHOD OF MEASUREMENT OF LOW RESISTANCE
    I.S. EN 140401-801:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    IEC 60115-6-102:1992 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - DETAIL SPECIFICATION: FIXED THICK FILM RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS, ALL OF EQUAL VALUE AND EQUAL DISSIPATION, CLASS 1 (SINGLE-IN-LINE NETWORK)
    I.S. EN 140101:2008 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS
    I.S. EN 140401-802:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 1; 2
    I.S. EN 140401-803:2007 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    IEC 60115-6-1:1983 Fixed resistors for use in electronic equipment. Part 6: Blank detail specification: Fixed resistor networks with individually measurable resistors, all of equal value and equal dissipation. Assessment level E
    IEC 60115-5-2:1992 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - BLANK DETAIL SPECIFICATION: FIXED PRECISION RESISTORS. ASSESSMENT LEVEL F
    IEC 60115-2:2014 Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors
    NF EN 140402-801 : 2005 DETAIL SPECIFICATION: FIXED LOW POWER WIRE-WOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5, 1, 2
    IEC 60115-8:2009 Fixed resistors for use in electronic equipment - Part 8: Sectional specification - Fixed surface mount resistors
    IEC 60115-6-2:1983 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - BLANK DETAIL SPECIFICATION: FIXED RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS OF EITHER DIFFERENT RESISTANCE VALUES OR DIFFERENT RATED DISSIPATIONS. ASSESSMENT LEVEL E
    IEC 60115-6-101:1992 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - DETAIL SPECIFICATION: FIXED THICK FILM RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS, ALL OF EQUAL VALUE AND EQUAL DISSIPATION, CLASS I (DUAL-IN-LINE NETWORK)
    IEC 60115-8-1:2014 Fixed resistors for use in electronic equipment - Part 8-1: Blank detail specification: Fixed surface mount (SMD) low power film resistors for general electronic equipment, classification level G
    I.S. EN 140100:2008 SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS
    I.S. EN 60115-9:2004 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS
    EN 140401-803 : 2007 AMD 3 2017 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - CYLINDRICAL - STABILITY CLASSES 0,05; 0,1; 0,25; 0,5; 1; 2
    EN 140101-806 : 2008 COR 2014 DETAIL SPECIFICATION: FIXED LOW POWER FILM RESISTORS - METAL FILM RESISTORS ON HIGH GRADE CERAMIC, CONFORMAL COATED OR MOLDED, AXIAL OR PREFORMED LEADS
    EN 140401-801:2007/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25; 0,5; 1
    IEC 60115-9:2003 Fixed resistors for use in electronic equipment - Part 9: Sectional specification: Fixed surface mount resistor networks with individually measurable resistors
    IEC 60127-4:2005+AMD1:2008+AMD2:2012 CSV Miniature fuses - Part 4: Universal modular fuse-links (UMF) -Through-hole and surface mount types
    BS EN 61188-5-2 : 2003 PRINTED BOARDS AND ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    IEC 60115-9-1:2003 Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification: Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ
    BS EN 140402-801 : 2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    IEC 61188-5-2:2003 Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components
    EN 140401-804:2011/A1:2013 DETAIL SPECIFICATION: FIXED LOW POWER FILM HIGH STABILITY SMD RESISTORS - RECTANGULAR - STABILITY CLASSES 0,1; 0,25
    EN 140402-801:2015 DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS - RECTANGULAR - STABILITY CLASSES 0,5; 1; 2
    EN 60127-4:2005/A2:2013 Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
    EN 140101:2008 Blank Detail Specification: Fixed low power film resistors
    EN 60115-2 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 2: SECTIONAL SPECIFICATION: LEADED FIXED LOW POWER FILM RESISTORS (IEC 60115-2:2014, MODIFIED)
    EN 60115-9-1 : 2004 Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification - Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ
    EN 61188-5-2 : 2003 PRINTED BOARDS AND PRINTED BOARD ASSEMBLIES - DESIGN AND USE - PART 5-2: ATTACHMENT (LAND/JOINT) CONSIDERATIONS - DISCRETE COMPONENTS
    EN 140401:2009 BLANK DETAIL SPECIFICATION: FIXED LOW POWER FILM SURFACE MOUNT (SMD) RESISTORS
    EN 140402:2015/A1:2016 BLANK DETAIL SPECIFICATION: FIXED LOW POWER WIREWOUND SURFACE MOUNT (SMD) RESISTORS
    EN 60115-9 : 2004 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 9: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTOR NETWORKS WITH INDIVIDUALLY MEASURABLE RESISTORS
    EN 60115-8 : 2012 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8: SECTIONAL SPECIFICATION - FIXED SURFACE MOUNT RESISTORS (IEC 60115-8:2009, MODIFIED)
    EN 60115-8-1 : 2015 FIXED RESISTORS FOR USE IN ELECTRONIC EQUIPMENT - PART 8-1: BLANK DETAIL SPECIFICATION: FIXED SURFACE MOUNT (SMD) LOW POWER FILM RESISTORS FOR GENERAL ELECTRONIC EQUIPMENT, CLASSIFICATION LEVEL G (IEC 60115-8-1:2014, MODIFIED)
    EN 140100:2008 SECTIONAL SPECIFICATION: FIXED LOW POWER FILM RESISTORS

    Standards Referencing This Book - (Show below) - (Hide below)

    IEC 61193-2:2007 Quality assessment systems - Part 2: Selection and use of sampling plans for inspection of electronic components and packages
    IEC 60068-1:2013 Environmental testing - Part 1: General and guidance
    IEC 60068-2-58:2015+AMD1:2017 CSV Environmental testing - Part 2-58: Tests - Test Td: Test methods for solderability, resistance to dissolution of metallization and to soldering heat of surface mounting devices (SMD)
    IEC 60068-2-27:2008 Environmental testing - Part 2-27: Tests - Test Ea and guidance: Shock
    IEC 60068-2-20:2008 Environmental testing - Part 2-20: Tests - Test T: Test methods for solderability and resistance to soldering heat of devices with leads
    IECQ 001002-3:2005 IEC QUALITY ASSESSMENT SYSTEM FOR ELECTRONIC COMPONENTS (IECQ) - RULES OF PROCEDURE - PART 3: APPROVAL PROCEDURES
    IEC 61249-2-7:2002 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-7: REINFORCED BASE MATERIALS CLAD AND UNCLAD - EPOXIDE WOVEN E-GLASS LAMINATED SHEET OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 60068-2-21:2006 Environmental testing - Part 2-21: Tests - Test U: Robustness of terminations and integral mounting devices
    IEC 60068-2-13:1983 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST M: LOW AIR PRESSURE
    IEC 60068-2-11:1981 ENVIRONMENTAL TESTING - TEST KA: SALT MIST
    IEC 61760-1:2006 Surface mounting technology - Part 1: Standard method for the specification of surface mounting components (SMDs)
    IEC 60068-2-67:1995 ENVIRONMENTAL TESTING - PART 2: TESTS - TEST CY: DAMP HEAT, STEADY STATE, ACCELERATED TEST PRIMARILY INTENDED FOR COMPONENTS
    IEC 60410:1973 Sampling plans and procedures for inspection by attributes
    IEC 60294:2012 MEASUREMENT OF THE DIMENSIONS OF A CYLINDRICAL COMPONENT WITH AXIAL TERMINATIONS
    IEC 60068-2-54:2006 Environmental testing - Part 2-54: Tests - Test Ta: Solderability testing of electronic components by the wetting balance method
    IEC 60068-2-2:2007 Environmental testing - Part 2-2: Tests - Test B: Dry heat
    IEC TR 60440 : 1.0 METHOD OF MEASUREMENT OF NON-LINEARITY IN RESISTORS
    IEC 60062:2016 Marking codes for resistors and capacitors
    IEC 61249-2-35:2008 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-35: REINFORCED BASE MATERIALS, CLAD AND UNCLAD - MODIFIED EPOXIDE WOVEN E-GLASS LAMINATE SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD FOR LEAD-FREE ASSEMBLY
    IEC 61340-3-1:2006 ELECTROSTATICS - PART 3-1: METHODS FOR SIMULATION OF ELECTROSTATIC EFFECTS - HUMAN BODY MODEL (HBM) ELECTROSTATIC DISCHARGE TEST WAVEFORMS
    IEC 60063:2015 PREFERRED NUMBER SERIES FOR RESISTORS AND CAPACITORS
    IEC 60068-2-29:1987 BASIC ENVIRONMENTAL TESTING PROCEDURES - TESTS - TEST EB AND GUIDANCE: BUMP
    IEC 60068-2-1:2007 Environmental testing - Part 2-1: Tests - Test A: Cold
    IEC 61249-2-22:2005 MATERIALS FOR PRINTED BOARDS AND OTHER INTERCONNECTING STRUCTURES - PART 2-22: REINFORCED BASE MATERIALS CLAD AND UNCLAD - MODIFIED NON-HALOGENATED EPOXIDE WOVEN E-GLASS LAMINATED SHEETS OF DEFINED FLAMMABILITY (VERTICAL BURNING TEST), COPPER-CLAD
    IEC 60060-1:2010 High-voltage test techniques - Part 1: General definitions and test requirements
    IEC 60695-11-5 : 2.0 FIRE HAZARD TESTING - PART 11-5: TEST FLAMES - NEEDLE-FLAME TEST METHOD - APPARATUS, CONFIRMATORY TEST ARRANGEMENT AND GUIDANCE
    IEC 60068-2-14:2009 Environmental testing - Part 2-14: Tests - Test N: Change of temperature
    IEC 60195:2016 Method of measurement of current noise generated in fixed resistors
    IEC 60068-2-30:2005 Environmental testing - Part 2-30: Tests - Test Db: Damp heat, cyclic (12 h + 12 h cycle)
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