IEC 60191-2V:1998
Current
The latest, up-to-date edition.
Twentieth supplement
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
22-12-1998
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Contents
Foreword
Preface
Chapter OO - Philosophy of Mechanical Standardization
Chapter O - Recommended Values for Certain Dimensions of
Drawings of Semiconductor Devices
Chapter I - Device Outline Drawings
Types of Semiconductor Devices Generally Mounted in the
Packages of Chapter 1
Chapter II - Base Drawings
Chapter III - Case Outline Drawings
Chapter IV - Gauge Drawings
Chapter V - Tables Showing Associations Between Case
Outlines and Bases
Obsolete Drawings
Additions to the Lists of National Codes Appearing on
the Standard Sheets of IEC Publication 191-2
Deletions to the Lists of National Codes Appearing on the
Standard Sheets of IEC Publication 191-2
Incorporated into main document IEC 60191 PT2.
| DevelopmentNote |
This standard is part of the Consolidated edition IEC 60191 PT2 1966 but can be purchased separately. Stability Date: 2020. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
23
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN IEC 60191-2V : 1999 | Identical |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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