IEC 60191-2W:1999
Current
The latest, up-to-date edition.
Twenty-first supplement
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
English - French
29-07-1999
Important note : Users cannot be edited or removed once added to your Multi user PDF.
Foreword
Preface
Philosophy of Mechanical Standardization
Recommended Values for Certain Dimensions of
Drawing of Semi-Conductor Devices
Device Outline Drawings
Types of Semi-Conductor Devices Generally Mounted
in the packages of Chapter I
Base Drawings
Case Outline Drawings
Gauge Drawings
Tables Showing Associations Between Case Outlines
and Bases
Obsolete Drawings
Additional to the List of National Codes Appearing on
the Standard Sheets of IEC Publication 191-22
Deletions to the Lists of National Codes Appearing on
the Standard Sheets of IEC Publication 191-2
Parts A-V are incorporated in the Consolidated edition of IEC 60191 PT2 (1966 Version). This is an additional supplement.
| DevelopmentNote |
Stability Date: 2020. (07/2015)
|
| DocumentType |
Standard
|
| Pages |
25
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
| Standards | Relationship |
| NEN IEC 60191-2W : 1999 | Identical |
| IEC 60191-6-6:2001 | Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA) |
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