Mechanical standardization of semiconductor devices - Part 2: Dimensions

Amended by

IEC 60191-2X:1999/COR1:2000

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Published date

30-09-1999

Publisher

International Electrotechnical Committee

The contents of the corrigendum of January 2000 have been included in this copy.

DevelopmentNote	Parts A-V are incorporated in the Consolidated edition of IEC 60191 PT2 (1966 Version). This is an additional supplement. (10/2012) Stability Date: 2020. (09/2017)
DocumentType	Standard
Pages	28
PublisherName	International Electrotechnical Committee
Status	Current

Standards	Relationship
NEN IEC 60191-2X : 1999 C1 2000	Identical

IEC 60191-6-6:2001

Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

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IEC 60191-2X:1999

Mechanical standardization of semiconductor devices - Part 2: Dimensions

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