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IEC 60191-2Z:2000

Current

Current

The latest, up-to-date edition.

Twenty-fourth supplement - Mechanical standardization of semiconductor devices - Part 2: Dimensions

Available format(s)

Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users

Language(s)

English - French

Published date

29-09-2000

FOREWORD
PREFACE
Chapter 00 - PHILOSOPHY OF MECHANICAL STANDARDIZATION
Chapter 0 - RECOMMENDED VALUES FOR CERTAIN DIMENSIONS OF
            DRAWINGS OF SEMI-CONDUCTOR DEVICES
Chapter I - DEVICE OUTLINE DRAWINGS
TYPES OF SEMICONDUCTOR DEVICES GENERALLY MOUNTED IN THE
PACKAGES OF CHAPTER I
Chapter II - BASE DRAWINGS
Chapter III - CASE OUTLINE DRAWINGS
Chapter IV - GAUGE DRAWINGS
Chapter V - TABLES SHOWING ASSOCIATIONS BETWEEN CASE
            OUTLINES AND BASES
OBSOLETE DRAWINGS
ADDITIONS TO THE LIST OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2
DELETIONS TO THE LISTS OF NATIONAL CODES APPEARING ON THE
STANDARD SHEETS OF IEC PUBLICATION 191-2

DevelopmentNote
Stability Date: 2020. (09/2017)
DocumentType
Standard
Pages
15
PublisherName
International Electrotechnical Committee
Status
Current

Standards Relationship
NEN IEC 60191-2Z : 2001 Identical

IEC 60191-6-6:2001 Mechanical standardization of semiconductor devices - Part 6-6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine pitch land grid array (FLGA)

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