IEC 60191-4:2013/AMD1:2018
Current
Current
The latest, up-to-date edition.
Amendment 1 - Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages
Amendment of
Available format(s)
Hardcopy , PDF , PDF 3 Users , PDF 5 Users , PDF 9 Users
Language(s)
English - French
Published date
27-03-2018
Publisher
| Committee |
TC 47/SC 47D
|
| DocumentType |
Amendment
|
| Pages |
29
|
| PublisherName |
International Electrotechnical Committee
|
| Status |
Current
|
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